Mechanism Perfboard: An Augmented Reality Environment for Linkage Mechanism Design and Fabrication, Yun Woo Jeong

Thermal interaction with a voice-based intelligent agent, Seyeong Kim

Yun Woo Jeong and Seyeong Kim  got their research works accepted at CHI 2018 with the advisory of professor Tek-Jin Nam. Ph.D candidate Yun Woo Jeong got his paper, ‘Mechanism Perfboard: An Augmented Reality Environment for Linkage Mechanism Design and Fabrication’ accepted. Master candidate Seyeong Kim got her poster work(Late-breaking work), ‘Thermal interaction with a voice-based intelligent agent’, accepted. They will be presenting their works at ACM CHI 2018 at Montreal, Canada during 23th April to 26th April.